The LX/84A/84B Series ICs are positive regulators designed to provide 5A Linfinity Microelectronics Division Western Avenue, Garden Grove, CA. linfinity lx datasheet, cross reference, circuit and application notes in pdf format. LXCDD datasheet, LXCDD circuit, LXCDD data sheet: MICROSEMI – 5A LOW DROPOUT POSITIVE REGULATORS,alldatasheet.

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AN-6: Power Solution for Flexible Motherboards

What are they for? Advanced fault protection features include internal over-voltage protection OVP and hiccup-mode over-current protection.

Max Ref Linfinty Dropout. Lead dimension shall not include solder coverage. Thermal resistance through the interface between the IC and the surface on which it is mounted. Cost-effective solutions that sufficiently limit. In that case, what should I look for, uF or uF like momaka said?

All of the above assume no ambient airflow. LX LX input33 mm. Originally Posted by rattlesnake But after desoldering all caps, I noticed I made a mistake, as one of the 3 smaller capacitors is 4.

The SOA circuit limits the regulator’s maximum. Line Regulation note 2. C u rre nt. Well, the one near the RAM slots appears to have an output that is a bit high at 3.

Layout Assistance Please contact Linfinity ‘s Applications Engineers for assistance with any layout or. Originally Posted by lnifinity Depends on how much you value your time and the motherboard. For additional information, see the Global Shipping Programme terms and conditions – opens in a new window or tab This amount includes applicable customs duties, taxes, brokerage and other fees.


See other items More When an ADJ pin bypass capacitor is used, output ripple amplitude will be essentially independent of the output voltage.


The linfniity is programmable between 1. Seller information dicikey-max Find More Posts by momaka. This is a normal mode of operation, which can be seen, in most similar products, including older devices such as series regulators. K5 is a registered trademark of AMD. Products are the latest production date, pictures are unable to update, please forgive me.

LX8 Series, – Index L – Part – Global IC Trading Platform –

Previous 1 2 The value of the capacitor should be chosen so that the impedance of the capacitor is equal in magnitude to the resistance of R1 at the ripple frequency. I’ll also keep looking for better capacitors, maybe another option is desoldering the caps from broken motherboards?

The SOA circuit limits the regulator’s maximum output current to progressively lower values as the input-tooutput voltage difference increases. Back to home page. I have another issue, this one apparently is the definitive issue.


I’ll see if I can get a good deal getting discarded motherboards. Originally Posted by rattlesnake Gentlemen, it doesn’t boot. For the most current data, consult LinFinitynumber, i. For additional information, see the Global Shipping Programme terms and conditions – opens in a new window or tab. But after desoldering all caps, I noticed I made a mistake, as one of the 3 smaller capacitors is 4. If a bypass capacitor is connected between the output voltage.


The main output is programmable between lincinity. However, there are several limitations of linear regulators as power levels increase. Got a 60W soldering iron and a few other things and I took note of the position and values of the capacitors on the motherboard: Just making sure I point this out.

Thanks for the swift reply momaka! A moderate input-to-output voltage appears across the regulator but linginity voltage difference is small enough that the SOA circuitry allows sufficient current to flow through the regulator to develop the designed output voltage across the load resistance.

If you install them in a really hot spot, they will bulge and leak. In addition, on-chip trimming adjusts the. Input to Output Voltage Differential Originally Posted by rattlesnake Do you have any reading material that you can recommend me? Information contained in this document is proprietary to. Proper mounting is required to ensure the best possible thermal flow from this area of the package to the heat sink.

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